This article discusses the influence of transient behavior of a semiconductor on the selection of your thermal solution. Also it shows the necessity of this study in order to get the correct selection of both heat sink and interface material. A selection that is based on average power will lead to wrong choices and insufficient cooling, without you being aware of this fact. An application in which a MOSFET is fitted onto a heat sink has been evaluated for steady state and transient behavior. This article discusses the advantages of the use of network analyses in order to obtain the most optimal thermal solution.
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White paper Transient thermal behavior of a Power MOSFET
